Low-Frequency Noise Measurements for Electromigration Characterization in BEOL Interconnects
In this paper we discuss a new EM test methodology, based on low-frequency noise (LFN) measurements. The main advantages of LFN over the standard accelerated EM tests are that they are non-destructive, much faster, closer to operation conditions and provide more fundamental understanding. Using the...
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| Published in | IEEE International Integrated Reliability Workshop final report pp. 1 - 9 |
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| Main Authors | , , , , , , |
| Format | Conference Proceeding |
| Language | English |
| Published |
IEEE
01.10.2019
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| Subjects | |
| Online Access | Get full text |
| ISSN | 2374-8036 |
| DOI | 10.1109/IIRW47491.2019.8989897 |
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| Summary: | In this paper we discuss a new EM test methodology, based on low-frequency noise (LFN) measurements. The main advantages of LFN over the standard accelerated EM tests are that they are non-destructive, much faster, closer to operation conditions and provide more fundamental understanding. Using the LFN technique, we study the EM properties in sub-30 nm line-width Cu interconnects with various metallization schemes. Furthermore, the EM activation energies of alternative metal interconnects (Ru, Co, W) are studied by means of LFN measurements. |
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| ISSN: | 2374-8036 |
| DOI: | 10.1109/IIRW47491.2019.8989897 |