Low-Frequency Noise Measurements for Electromigration Characterization in BEOL Interconnects

In this paper we discuss a new EM test methodology, based on low-frequency noise (LFN) measurements. The main advantages of LFN over the standard accelerated EM tests are that they are non-destructive, much faster, closer to operation conditions and provide more fundamental understanding. Using the...

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Bibliographic Details
Published inIEEE International Integrated Reliability Workshop final report pp. 1 - 9
Main Authors Beyne, S., Croes, K., Pedreira, O. Varela, Arnoldi, L., van der Veen, M. H., De Wolf, I., Tokei, Zs
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2019
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ISSN2374-8036
DOI10.1109/IIRW47491.2019.8989897

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Summary:In this paper we discuss a new EM test methodology, based on low-frequency noise (LFN) measurements. The main advantages of LFN over the standard accelerated EM tests are that they are non-destructive, much faster, closer to operation conditions and provide more fundamental understanding. Using the LFN technique, we study the EM properties in sub-30 nm line-width Cu interconnects with various metallization schemes. Furthermore, the EM activation energies of alternative metal interconnects (Ru, Co, W) are studied by means of LFN measurements.
ISSN:2374-8036
DOI:10.1109/IIRW47491.2019.8989897