TSV-based PUF circuit for 3DIC sensor nodes in IoT applications

Sensor nodes massively deployed in Internet of Things are subject to physical capture, hardware tampering, device cloning, and unauthorized device alteration. This paper presented a novel ring oscillator PUF (Physical Unclonable Function) circuit exploiting the process variation of both CMOS devices...

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Bibliographic Details
Published in2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) pp. 313 - 316
Main Authors Chao Wang, Jun Zhou, Guruprasad, Katti, Xin Liu, Weerasekera, Roshan, Kim, Tony T.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2015
Subjects
3D IC
Conferences
Electron devices
IoT
Process Variations
PUF
Ring Oscillator
Solid state circuits
TSV
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ISBN9781479983629
1479983624
DOI10.1109/EDSSC.2015.7285113

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Summary:Sensor nodes massively deployed in Internet of Things are subject to physical capture, hardware tampering, device cloning, and unauthorized device alteration. This paper presented a novel ring oscillator PUF (Physical Unclonable Function) circuit exploiting the process variation of both CMOS devices and TSVs (Through Silicon Vias) available on TSV-based 3D stacking sensor nodes, for secure data generation resistant to physical attacks. As far as we know from the literature, this is the first work on TSV-based 3D PUF circuits. Simulation results based on a 0.18-μm CMOS technology and a 5.2-μm via-last TSV technology show that the proposed 3D PUF circuit has stronger uniqueness and reproducibility in PUF behavior.
ISBN:9781479983629
1479983624
DOI:10.1109/EDSSC.2015.7285113