3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

• Published in: 2008 IEEE Custom Integrated Circuits Conference pp. 663 - 670
• Main Authors: Bakir, M.S., King, C., Sekar, D., Thacker, H., Bing Dang, Gang Huang, Naeemi, A., Meindl, J.D.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.09.2008
• Subjects: Integrated optics; Liquid cooling; Microfluidics; Optical interconnections; Optical pumping; Power system interconnection; Routing; Stacking; Thermal resistance; Through-silicon vias
• ISBN: 9781424420186; 1424420180
• ISSN: 0886-5930
• DOI: 10.1109/CICC.2008.4672173

This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical interconnects are used to enable optical signal routing to all levels of the 3D stack, and the microfluidic interconnects are used to cool each level in the 3D stack and thus enable stacking of high-performance (high-power) dice. These interconnects are integrated in a 3D stack both as through-silicon vias (TSVs) and as input/output (I/O) interconnects. Design trade-offs (TSV density, power supply noise, thermal resistance, and pump size), fabrication, and assembly are reported.