3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical interconnects are used to enable optical signal rou...

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Bibliographic Details
Published in2008 IEEE Custom Integrated Circuits Conference pp. 663 - 670
Main Authors Bakir, M.S., King, C., Sekar, D., Thacker, H., Bing Dang, Gang Huang, Naeemi, A., Meindl, J.D.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2008
Subjects
Integrated optics
Liquid cooling
Microfluidics
Optical interconnections
Optical pumping
Power system interconnection
Routing
Stacking
Thermal resistance
Through-silicon vias
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ISBN9781424420186
1424420180
ISSN0886-5930
DOI10.1109/CICC.2008.4672173

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Summary:This paper describes a novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack. The electrical interconnects are used to provide power delivery and signaling, the optical interconnects are used to enable optical signal routing to all levels of the 3D stack, and the microfluidic interconnects are used to cool each level in the 3D stack and thus enable stacking of high-performance (high-power) dice. These interconnects are integrated in a 3D stack both as through-silicon vias (TSVs) and as input/output (I/O) interconnects. Design trade-offs (TSV density, power supply noise, thermal resistance, and pump size), fabrication, and assembly are reported.
ISBN:9781424420186
1424420180
ISSN:0886-5930
DOI:10.1109/CICC.2008.4672173