APA (7th ed.) Citation

Bakir, M., King, C., Sekar, D., Thacker, H., Dang, B., Huang, G., . . . Meindl, J. (2008, September). 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. 2008 IEEE Custom Integrated Circuits Conference, 663-670. https://doi.org/10.1109/CICC.2008.4672173

Chicago Style (17th ed.) Citation

Bakir, M.S, C. King, D. Sekar, H. Thacker, Bing Dang, Gang Huang, A. Naeemi, and J.D Meindl. "3D Heterogeneous Integrated Systems: Liquid Cooling, Power Delivery, and Implementation." 2008 IEEE Custom Integrated Circuits Conference Sep. 2008: 663-670. https://doi.org/10.1109/CICC.2008.4672173.

MLA (9th ed.) Citation

Bakir, M.S, et al. "3D Heterogeneous Integrated Systems: Liquid Cooling, Power Delivery, and Implementation." 2008 IEEE Custom Integrated Circuits Conference, Sep. 2008, pp. 663-670, https://doi.org/10.1109/CICC.2008.4672173.