All lead free IGBT module with excellent reliability

The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated...

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Bibliographic Details
Published inProceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005 pp. 79 - 82
Main Authors Nishimura, Y., Oonishi, K., Morozumi, A., Mochizuki, E., Takahashi, Y.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Ceramics
Copper
Environmentally friendly manufacturing techniques
Insulated gate bipolar transistors
Insulation
Lead
Soldering
Temperature
Thermal conductivity
Thermal expansion
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ISBN0780388909
9780780388901
ISSN1063-6854
DOI10.1109/ISPSD.2005.1487955

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Summary:The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.
ISBN:0780388909
9780780388901
ISSN:1063-6854
DOI:10.1109/ISPSD.2005.1487955