APA (7th ed.) Citation

Roy, R., Das, S., Labbe, B., Mathur, R., & Jeloka, S. (2022, May). Co-design of Thermal Management with System Architecture and Power Management for 3D ICs. Proceedings / Electronic Components Conference, 211-220. https://doi.org/10.1109/ECTC51906.2022.00044

Chicago Style (17th ed.) Citation

Roy, Rishav, Shidhartha Das, Benoit Labbe, Rahul Mathur, and Supreet Jeloka. "Co-design of Thermal Management with System Architecture and Power Management for 3D ICs." Proceedings / Electronic Components Conference May. 2022: 211-220. https://doi.org/10.1109/ECTC51906.2022.00044.

MLA (9th ed.) Citation

Roy, Rishav, et al. "Co-design of Thermal Management with System Architecture and Power Management for 3D ICs." Proceedings / Electronic Components Conference, May. 2022, pp. 211-220, https://doi.org/10.1109/ECTC51906.2022.00044.