APA (7th ed.) Citation

Kim, K., & Keovisai, M. (2025, June 2). Bevel Engineering in Advanced Packaging. Proceedings of the IEEE International Interconnect Technology Conference, 1-3. https://doi.org/10.1109/IITC66087.2025.11075359

Chicago Style (17th ed.) Citation

Kim, Keechan, and Moty Keovisai. "Bevel Engineering in Advanced Packaging." Proceedings of the IEEE International Interconnect Technology Conference 2 Jun. 2025: 1-3. https://doi.org/10.1109/IITC66087.2025.11075359.

MLA (9th ed.) Citation

Kim, Keechan, and Moty Keovisai. "Bevel Engineering in Advanced Packaging." Proceedings of the IEEE International Interconnect Technology Conference, 2 Jun. 2025, pp. 1-3, https://doi.org/10.1109/IITC66087.2025.11075359.

Warning: These citations may not always be 100% accurate.