Bevel Engineering in Advanced Packaging

As the semiconductor industry adopts new and more complex advanced packaging schemes, the wafer edge becomes increasingly important in terms of maximizing yield. This paper will provide an overview of packaging applications for both plasma bevel etch and PECVD bevel deposition. Bevel etch has long b...

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Bibliographic Details
Published inProceedings of the IEEE International Interconnect Technology Conference pp. 1 - 3
Main Authors Kim, Keechan, Keovisai, Moty
Format Conference Proceeding
LanguageEnglish
Published IEEE 02.06.2025
Subjects
3DIC
Bevel deposition
Bevel etch
Bonding
Contamination
Coronus
Electronics industry
Instruments
Metals
Packaging
Plasmas
Prevention and mitigation
Silicon
Online AccessGet full text
ISSN2380-6338
DOI10.1109/IITC66087.2025.11075359

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Summary:As the semiconductor industry adopts new and more complex advanced packaging schemes, the wafer edge becomes increasingly important in terms of maximizing yield. This paper will provide an overview of packaging applications for both plasma bevel etch and PECVD bevel deposition. Bevel etch has long been used in wafer processing to reduce edge defects but has become instrumental in maintaining wafer edge health for chip-to-wafer and wafer-to-wafer bonding schemes. Bevel deposition replaces multiple process steps with a single annular deposition of Si or C-based film and is being adopted for metal contamination mitigation and edge roll-off compensation prior to wafer-to-wafer bonding.
ISSN:2380-6338
DOI:10.1109/IITC66087.2025.11075359