Advanced Patterning: Tackling the big problems in printing small features

The dramatic rise in demand for AI capability coupled with its ever-increasing hunger for the most advanced semiconductor devices, make the chances of achieving the forecasted 1trillion semiconductor industry value by 2030 look more plausible than ever. However, achieving perfect device functionalit...

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Bibliographic Details
Published inProceedings of the IEEE International Interconnect Technology Conference pp. 1 - 3
Main Author Eynon, Benjamin G.
Format Conference Proceeding
LanguageEnglish
Published IEEE 02.06.2025
Subjects
Artificial intelligence
Electronics industry
Printing
Semiconductor device manufacture
Semiconductor devices
Online AccessGet full text
ISSN2380-6338
DOI10.1109/IITC66087.2025.11075405

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Summary:The dramatic rise in demand for AI capability coupled with its ever-increasing hunger for the most advanced semiconductor devices, make the chances of achieving the forecasted 1trillion semiconductor industry value by 2030 look more plausible than ever. However, achieving perfect device functionality and high yield requires that semiconductor manufacturing process technologies all work in concert with one another at the angstrom scale. The search for ways and means to manufacture such incredibly complex devices at high yield has led the semiconductor industry to look its advanced patterning toolbox once again for answers.
ISSN:2380-6338
DOI:10.1109/IITC66087.2025.11075405