Verification of Circuit Signal Detection Method for Non-contact Measurement System

With the size of electronics products becoming smaller, the EMC issue is more important. The common use of analysis technique in EMC issues is contact-measurement technology. However, the high circuit density in package, it's hard to make sure every single trace design with test point for conta...

Full description

Saved in:
Bibliographic Details
Published in2023 International Conference on Electronics Packaging (ICEP) pp. 259 - 260
Main Authors Guo, Min-Jun, Lin, Shu-Yu, Wang, Yu-Cong, Hsieh, Chia-Lin, Wu, Sung-Mao, Chou, Shang-Chih
Format Conference Proceeding
LanguageEnglish
Published Japan Institute of Electronics Packaging 19.04.2023
Subjects
De-embedding Technique
Electromagnetic compatibility
Equivalent Circuit Model
Impedance
Junctions
Near Field Measurement
Non-contact Signal Excite
Power transmission lines
Probes
Reflection
Transmission line measurements
Online AccessGet full text
DOI10.23919/ICEP58572.2023.10129663

Cover

More Information
Summary:With the size of electronics products becoming smaller, the EMC issue is more important. The common use of analysis technique in EMC issues is contact-measurement technology. However, the high circuit density in package, it's hard to make sure every single trace design with test point for contact-measurement. Non-contact technique such as nearfield measurement become popular with the advantage that it doesn't require test point. Nearfield-measurement is usually used to find hot spots of the electromagnetic field and realized which region is the main noise location. To realize the reason for noise, coupling loss between probe and DUT should be de-embed.
DOI:10.23919/ICEP58572.2023.10129663