Thermal Modelling for an Electrothermal Model of GaN Devices

Global resource constraints and climate change have led to rethink about the use of the combustion engine in traditional transport systems. As a result, automotive manufacturers and equipment suppliers are moving towards hybrid vehicles. This change is leading electronics designers to use Gallium Ni...

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Bibliographic Details
Published inInternational Renewable Energy Congress (Online) pp. 1 - 6
Main Authors Besserour, Mohamed Akram, Eloued, Sonia, Hadj Slama, Jaleleddine Ben, Fouquet, Francois, Kadi, Moncef
Format Conference Proceeding
LanguageEnglish
Published IEEE 26.10.2021
Subjects
Aging
Climate change
Electronic packaging thermal management
Electrothermal model
Finite element analysis
finite elements simulation
Gallium Nitride (GaN)
Multichip modules
Reliability
Temperature
Threshold voltage
Transistors
WLSCP-LGA
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ISSN2378-3451
DOI10.1109/IREC52758.2021.9624883

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Summary:Global resource constraints and climate change have led to rethink about the use of the combustion engine in traditional transport systems. As a result, automotive manufacturers and equipment suppliers are moving towards hybrid vehicles. This change is leading electronics designers to use Gallium Nitride (GaN) technology within power modules. The use of this new technology may call into question the reliability of the system, which is directly related to the device aging. Among factors that can influence component aging is temperature. This paper describes the internal structure of a chosen device which is presented in LGA (Land Grid Array) package in order to create a thermal model through a finite element study that aims at extracting an electrothermal model describing the real component behavior within power module.
ISSN:2378-3451
DOI:10.1109/IREC52758.2021.9624883