Microstructure and magnetic properties dependence on the thickness of TbxDy1−xFe2 thin films sputtered on Pt/TiO2/SiO2/Si substrate
TbxDy1−xFe2 (Terfenol-D) thin films were grown in situ at 500°C on Pt/TiO2/SiO2/Si substrate by multi-target sputtering. The thickness effect of the Terfenol-D layer on the microstructure and on the magnetic properties was investigated. Magnetic force microscopy was used to observe local domain patt...
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Published in | Thin solid films Vol. 623; pp. 138 - 146 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
01.02.2017
Elsevier |
Subjects | |
Online Access | Get full text |
ISSN | 0040-6090 1879-2731 |
DOI | 10.1016/j.tsf.2016.12.032 |
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Summary: | TbxDy1−xFe2 (Terfenol-D) thin films were grown in situ at 500°C on Pt/TiO2/SiO2/Si substrate by multi-target sputtering. The thickness effect of the Terfenol-D layer on the microstructure and on the magnetic properties was investigated. Magnetic force microscopy was used to observe local domain patterns. Strong changes in the shape of magnetic domains were observed when the thickness of the Terfenol-D film was increased. Transmission Electron Microscopy observations showed that in situ elaboration at 500°C gives rise to large diffusion of the platinum of the bottom electrode into the Terfenol-D film leading to different sub-layers. Saturation magnetization values increased from 500 to 840kA/m, and coercive fields from 15 to 140kA/m, respectively, when the thickness of the Terfenol-D film was varied from 100 to 1000nm. Co-sputtering of Pt and Terfenol-D through the entire film thickness led to a similar saturation magnetization as well as an interesting strong decrease of the coercive field of these mixed films.
•Influence of the thickness of Terfenol-D films on their structural and magnetic properties.•Diffusion of Pt into Terfenol-D films and influence on films' properties.•Comparison of the properties of co-sputtered Pt/Terfenol-D films with “pure” Terfenol-D films. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2016.12.032 |