Si3N4/TiC纳米复合陶瓷材料R曲线行为
在微米Si3N4基体中加入亚微米Si3N4及纳米TiC颗粒,热压烧结制备出力学性能良好的Si3N4/TiC纳米复合陶瓷材料。采用压痕-弯曲强度法测定了复合材料的裂纹扩展阻力曲线(R曲线)。结果表明:材料呈现出上升的阻力曲线特性,显示出增强的抗裂纹扩展能力。其中,加入质量分数为10%亚微米Si3N4颗粒和15%纳米TiC颗粒的复合材料显示出较为优越的抗裂纹扩展能力,其阻力曲线上升最陡,上升幅度最大。分析表明:弥散的TiC粒子同基体之间弹性模量和热膨胀失配以及Si3N4类晶须拔出与桥联补强协同增韧,有助于纳米复合材料抑制主裂纹失稳扩展,导致复合材料的阻力曲线行为。...
        Saved in:
      
    
          | Published in | 材料工程 no. 7; pp. 76 - 80 | 
|---|---|
| Main Author | |
| Format | Journal Article | 
| Language | Chinese | 
| Published | 
            山东大学机械工程学院高效洁净机械制造教育部重点实验室,济南250061%山东大学机械工程学院高效洁净机械制造教育部重点实验室,济南,250061
    
        2012
     山东大学材料科学与工程学院,济南250061 山东建筑大学机电工程学院,济南250101  | 
| Subjects | |
| Online Access | Get full text | 
| ISSN | 1001-4381 1001-4381  | 
| DOI | 10.3969/j.issn.1001-4381.2012.07.016 | 
Cover
| Summary: | 在微米Si3N4基体中加入亚微米Si3N4及纳米TiC颗粒,热压烧结制备出力学性能良好的Si3N4/TiC纳米复合陶瓷材料。采用压痕-弯曲强度法测定了复合材料的裂纹扩展阻力曲线(R曲线)。结果表明:材料呈现出上升的阻力曲线特性,显示出增强的抗裂纹扩展能力。其中,加入质量分数为10%亚微米Si3N4颗粒和15%纳米TiC颗粒的复合材料显示出较为优越的抗裂纹扩展能力,其阻力曲线上升最陡,上升幅度最大。分析表明:弥散的TiC粒子同基体之间弹性模量和热膨胀失配以及Si3N4类晶须拔出与桥联补强协同增韧,有助于纳米复合材料抑制主裂纹失稳扩展,导致复合材料的阻力曲线行为。 | 
|---|---|
| Bibliography: | 11-1800/TB silicon nitride ;R-curve ; nanocomposite ceramic ; indentation-strength Si3N4/TiC nanocomposite ceramic materials were fabricated via hot pressing technique by adding submicro Si3N4 and nano-TiC powders and with Al3O3 and Y2O3 as additives. The crack growth resistance behavior (R-curve) of ceramic materials was evaluated using the indentation- strength method. The results indicate that the ceramic materials possess rising R-curve behavior, which exhibits an excellent crack growth resistance. The sample with 10% (mass fraction) submicro- Si3N4 and 15% nano-TiC has a steepest rising R-curve. Observation and analysis indicate that these phenomena can be attributed mainly to the synergetic toughening mechanism caused by pull-out and bridging of the Si3N4 quasiwhiskers, the elastic modulus and thermal expansion mismatch between Si3 N4 and TiC particles. LU Zhi-jie , ZHAO Jun (1 School of Materials Science and Engineering,Shandong University,Jinan 250061, China;2 School of Mechanical and Electronic Engineer  | 
| ISSN: | 1001-4381 1001-4381  | 
| DOI: | 10.3969/j.issn.1001-4381.2012.07.016 |