Electrochemical Assembly of Thiol-based Monolayer on Copper for Epoxy-Cu Adhesion Improvement

This work reports on the adhesion enhancement effects of self-assembled organothiol treatment on copper/epoxy interfaces, as well as a significant reduction in treatment time under the influence of electric potential. The interfacial adhesion has a 20-fold enhancement through the treatment due to im...

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Bibliographic Details
Published inElectrochimica acta Vol. 121; pp. 57 - 63
Main Authors Kwok, Stephen C.T., Ciucci, Francesco, Yuen, Matthew M.F.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.03.2014
Subjects
ADHESION
Adhesive strength
Adsorption
Assembly
Copper
Electric potential
Electro-assisted assembly
EPOXIES
Linkages
MICA
Monolayers
Self Assembly Monolayer
Strength
Thiol
Thiol
Electro-assisted assembly
Adsorption
Copper
Self Assembly Monolayer
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ISSN0013-4686
1873-3859
DOI10.1016/j.electacta.2013.12.146

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Summary:This work reports on the adhesion enhancement effects of self-assembled organothiol treatment on copper/epoxy interfaces, as well as a significant reduction in treatment time under the influence of electric potential. The interfacial adhesion has a 20-fold enhancement through the treatment due to improved linkage between the copper substrate and epoxy layer by chemisorbed organothiol molecules. The treatment time was greatly reduced by a factor of 32 from 16hours to 30minutes, thanks to the electrical field assisted method. This was achieved without compromising the maximum adhesion strength, which was shown to be in the order of 97.2 Jm−2.
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ISSN:0013-4686
1873-3859
DOI:10.1016/j.electacta.2013.12.146