Time-Impact Optimal Trajectory Planning for Wafer-Handling Robotic Arms Based on the Improved Snake Optimization Algorithm

To enhance the working efficiency of a wafer-handling robotic arm and simultaneously alleviate the impact and vibration during the motion process, a trajectory planning approach based on an improved snake optimization (ISO) algorithm is proposed. The following improvements have been made to the snak...

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Bibliographic Details
Published inSensors (Basel, Switzerland) Vol. 25; no. 6; p. 1872
Main Authors Ji, Yujie, Yu, Jiale
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 18.03.2025
MDPI
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ISSN1424-8220
1424-8220
DOI10.3390/s25061872

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Summary:To enhance the working efficiency of a wafer-handling robotic arm and simultaneously alleviate the impact and vibration during the motion process, a trajectory planning approach based on an improved snake optimization (ISO) algorithm is proposed. The following improvements have been made to the snake optimization (SO) algorithm: the introduction of a Chaotic Tent Map for initializing the swarm, the use of randomly perturbed dynamic learning factors to replace fixed values, the application of a cosine annealing learning rate for self-adaptively updating individual positions, and the incorporation of Bayesian optimization for parameterization and fine-tuning of the system’s selection process. Furthermore, the ISO algorithm is applied in the Cartesian space of the robotic arm to effectively address the trajectory planning challenge of the single-segment start–stop S-shaped speed curve with arc transitions. The simulation results indicate that the improved S-shaped speed curve has increased by 24.1% compared with the original plan, and the mean and variance rankings of ISO algorithm have, respectively, improved by 60.8% and 63.4%, compared with the SO algorithm. Meanwhile, this study has successfully achieved the Pareto optimal solution with time and impact as the targets based on the established MATLAB experimental simulation platform.
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ISSN:1424-8220
1424-8220
DOI:10.3390/s25061872