Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers

Wear of fixed abrasive diamond wire affects the quality of sliced silicon wafers, necessitating replacement of the costly wire. This paper analyzes the effect of wire wear on the surface morphology, roughness, and subsurface damage of as-cut single crystal silicon wafers. Scanning electron microscop...

Full description

Saved in:
Bibliographic Details
Published inWear Vol. 364-365; pp. 163 - 168
Main Authors Kumar, Arkadeep, Kaminski, Steffi, Melkote, Shreyes N., Arcona, Chris
Format Journal Article
LanguageEnglish
Published Elsevier B.V 15.10.2016
Subjects
Diamond
Silicon wafer
Subsurface damage
Surface
Wear
Wire sawing
Diamond
Subsurface damage
Wear
Silicon wafer
Wire sawing
Surface
Online AccessGet full text
ISSN0043-1648
1873-2577
DOI10.1016/j.wear.2016.07.009

Cover

More Information
Summary:Wear of fixed abrasive diamond wire affects the quality of sliced silicon wafers, necessitating replacement of the costly wire. This paper analyzes the effect of wire wear on the surface morphology, roughness, and subsurface damage of as-cut single crystal silicon wafers. Scanning electron microscopy, Raman spectroscopy, confocal microscopy, focused ion beam machining (FIB), and biaxial flexure are used to evaluate the surface morphology, areal surface roughness, and subsurface damage (cracks). Results show that, with increased wire wear, the wafers exhibit greater evidence of ductile removal, lower surface roughness, fewer but slightly deeper subsurface cracks, and lower average fracture strength.
ISSN:0043-1648
1873-2577
DOI:10.1016/j.wear.2016.07.009