A novel method for sacrificial layer release in MEMS devices fabrication

During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a nov...

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Bibliographic Details
Published inChinese physics B Vol. 19; no. 7; pp. 460 - 466
Main Author 石莎莉 陈大鹏 景玉鹏 欧毅 叶甜春 徐秋霞
Format Journal Article
LanguageEnglish
Published IOP Publishing 01.07.2010
Subjects
Design engineering
Devices
Dimpling
High aspect ratio
Holes
MEMS器件
Releasing
Shear stress
Silicon substrates
应力传感器
微机电系统
牺牲层
绝缘性能
设计规则
高宽比
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ISSN1674-1056
2058-3834
DOI10.1088/1674-1056/19/7/076802

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Summary:During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a novel ＇dimpled＇ method in releasing sacrificial layer. Based on the conception of pull-in length in adhering Phenomenon, the fabrication and releasing sacrificial layer methods using micro bumps based on the silicon substrate were presented. According to the thermal isolation performances of one kind of micro electromechanical system device thermal shear stress sensor, the sacrificial layers were validated to be successfully released.
Bibliography:sacrificial layer, adhering, pull in length, bump
TP212
11-5639/O4
TH-39
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SourceType-Scholarly Journals-1
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ISSN:1674-1056
2058-3834
DOI:10.1088/1674-1056/19/7/076802