On the numerical prediction of radiative heat transfer for thermoset automated fiber placement

• Published in: Composites. Part A, Applied science and manufacturing Vol. 67; pp. 282 - 288
• Main Authors: Hörmann, P., Stelzl, D., Lichtinger, R., Van Nieuwenhove, S., Mazón Carro, G., Drechsler, K.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.12.2014; Elsevier
• Subjects: A. Thermosetting resin; Applied sciences; Automated; automation; C. Computational modelling; composite materials; Density; E. Lay-up (manual/automated); E. Thermal analysis; Emitters; Exact sciences and technology; Fiber placement; Forms of application and semi-finished materials; Heat transfer; Infrared; Laminates; Mathematical models; model validation; Orientation; Polymer industry, paints, wood; prediction; surface temperature; Technology of polymers; Thermosetting resins; A. Thermosetting resin; E. Thermal analysis; E. Lay-up (manual/automated); C. Computational modelling; Experimental test; Laminate; Fiber reinforced material; Theoretical study; Surface temperature; Two dimensional model; Modeling; Optimization; Thermosetting resin; Manufacturing process; Numerical simulation; Processing parameter; Stratification; Heat transfer
• ISSN: 1359-835X; 1878-5840
• DOI: 10.1016/j.compositesa.2014.08.019

During thermoset automated fiber placement the material temperature has to be adapted to the material being processed. The position and orientation of infrared emitters relative to the substrate influence the material temperature, as do power output and processing speed. The novelty of this paper resides in the numerical description of the radiative heat produced by an infrared emitter as a function of the position and orientation and power density of the emitter. The combination with a 2D thermal model allows the prediction of material temperatures during the process. The model was validated by comparing with experimental data. The change in material temperature depending on different positions and orientations of the infrared emitter was demonstrated. The model allows the optimization of processing speed and power output of the infrared emitter for different positions and orientations in order to obtain a constant laminate surface temperature.