Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

• Published in: Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Vol. 823; pp. 1 - 8
• Main Authors: Tehrani, N. Alipour, Arfaoui, S., Benoit, M., Dannheim, D., Dette, K., Hynds, D., Kulis, S., Perić, I., Petrič, M., Redford, S., Sicking, E., Valerio, P.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.07.2016
• Subjects: Assemblies; Capacitively coupled pixel detectors; Chips; CLIC; Cross coupling; Detectors; HV-CMOS; Joining; Particle beams; Pixels; Sensors; Silicon detectors; Vertex detectors; Silicon detectors; Capacitively coupled pixel detectors; CLIC; Vertex detectors; HV-CMOS
• ISSN: 0168-9002; 1872-9576
• DOI: 10.1016/j.nima.2016.03.072

The vertex detector at the proposed CLIC multi-TeV linear e+e− collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor, where efficiencies of greater than 99% have been achieved at −60V substrate bias, with a single hit resolution of 6.1μm. Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.