Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm

In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived for signal integrity and power integrity, respectively. A general optimization flow is presented, wh...

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Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 5; no. 2; pp. 232 - 244
Main Authors Zhuo-Yue Li, Mu-Shui Zhang
Format Journal Article
LanguageEnglish
Published IEEE 01.02.2015
Subjects
Ball grid array (BGA) package
Biological cells
Genetic algorithms
Inductance
Linear programming
Optimization
pin assignment
Pins
signal integrity (SI)
Silicon
system in package (SiP)
Ball grid array (BGA) package
pin assignment
system in package (SiP)
signal integrity (SI)
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ISSN2156-3950
2156-3985
DOI10.1109/TCPMT.2014.2386855

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Summary:In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived for signal integrity and power integrity, respectively. A general optimization flow is presented, where the basic concepts of GA optimization are introduced and some important considerations for package design are demonstrated. A customized GA flow and two accelerating strategies are developed to improve the efficiency of the optimization procedure. Using GA optimization, the P/G pin assignment of a 40 × 40 BGA package with blocks of core, inputs/outputs and differential pairs can be generated in a few tens of minutes automatically.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2014.2386855