Multi-material topology optimization for the transient heat conduction problem using a sequential quadratic programming algorithm

• Published in: Engineering optimization Vol. 50; no. 12; pp. 2091 - 2107
• Main Authors: Long, Kai, Wang, Xuan, Gu, Xianguang
• Format: Journal Article
• Language: English
• Published: Abingdon Taylor & Francis 02.12.2018; Taylor & Francis Ltd
• Subjects: Asymptotes; Computational efficiency; Computing time; Conduction heating; Conductive heat transfer; Cost analysis; Design optimization; Isotropic material; Iterative methods; multi-material topology optimization; Quadratic programming; sequential quadratic programming; Series expansion; Taylor series; thermal compliance; Topology optimization; Transient heat conduction; Weight
• ISSN: 0305-215X; 1029-0273
• DOI: 10.1080/0305215X.2017.1417401

Transient heat conduction analysis involves extensive computational cost. It becomes more serious for multi-material topology optimization, in which many design variables are involved and hundreds of iterations are usually required for convergence. This article aims to provide an efficient quadratic approximation for multi-material topology optimization of transient heat conduction problems. Reciprocal-type variables, instead of relative densities, are introduced as design variables. The sequential quadratic programming approach with explicit Hessians can be utilized as the optimizer for the computationally demanding optimization problem, by setting up a sequence of quadratic programs, in which the thermal compliance and weight can be explicitly approximated by the first and second order Taylor series expansion in terms of design variables. Numerical examples show clearly that the present approach can achieve better performance in terms of computational efficiency and iteration number than the solid isotropic material with penalization method solved by the commonly used method of moving asymptotes. In addition, a more lightweight design can be achieved by using multi-phase materials for the transient heat conductive problem, which demonstrates the necessity for multi-material topology optimization.