Self-Aligned Double and Quadruple Patterning Aware Grid Routing Methods

Although self-aligned double and quadruple patterning (SADP, SAQP) have promising processes for sub-20 nm node advanced technologies and beyond, not all layouts are compatible with them. In advanced technologies, feasible wafer image should be generated effectively by utilizing SADP and SAQP where a...

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Published inIEEE transactions on computer-aided design of integrated circuits and systems Vol. 34; no. 5; pp. 753 - 765
Main Authors Kodama, Chikaaki, Ichikawa, Hirotaka, Nakayama, Koichi, Nakajima, Fumiharu, Nojima, Shigeki, Kotani, Toshiya, Ihara, Takeshi, Takahashi, Atsushi
Format Journal Article
LanguageEnglish
Published IEEE 01.05.2015
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ISSN0278-0070
1937-4151
DOI10.1109/TCAD.2015.2404878

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Abstract Although self-aligned double and quadruple patterning (SADP, SAQP) have promising processes for sub-20 nm node advanced technologies and beyond, not all layouts are compatible with them. In advanced technologies, feasible wafer image should be generated effectively by utilizing SADP and SAQP where a wafer image is determined by a selected mandrel pattern. However, predicting a mandrel pattern is not easy since it is different from the wafer image (or target pattern). In this paper, we propose new routing methods for spacer-is-dielectric (SID)-type SADP, SID-type SAQP, and spacer-is-metal (SIM)-type SADP to generate a feasible layout satisfying the connection requirements. Routing algorithms comprising simple connecting and cutting rules are performed on a new grid structure where two (SID-type SADP) or three colors (SID-type SAQP and SIM-type SADP) are assigned alternately to grid-nodes. Then a mandrel pattern is selected without complex coloring or decomposition methods. Also, we try to reduce hotspots (potentially defective regions) by the proposed dummy pattern flipping for SID-type SADP. In experiments, feasible layouts meeting the connection requirements are generated and the effectiveness of the proposed framework is confirmed.
AbstractList Although self-aligned double and quadruple patterning (SADP, SAQP) have promising processes for sub-20 nm node advanced technologies and beyond, not all layouts are compatible with them. In advanced technologies, feasible wafer image should be generated effectively by utilizing SADP and SAQP where a wafer image is determined by a selected mandrel pattern. However, predicting a mandrel pattern is not easy since it is different from the wafer image (or target pattern). In this paper, we propose new routing methods for spacer-is-dielectric (SID)-type SADP, SID-type SAQP, and spacer-is-metal (SIM)-type SADP to generate a feasible layout satisfying the connection requirements. Routing algorithms comprising simple connecting and cutting rules are performed on a new grid structure where two (SID-type SADP) or three colors (SID-type SAQP and SIM-type SADP) are assigned alternately to grid-nodes. Then a mandrel pattern is selected without complex coloring or decomposition methods. Also, we try to reduce hotspots (potentially defective regions) by the proposed dummy pattern flipping for SID-type SADP. In experiments, feasible layouts meeting the connection requirements are generated and the effectiveness of the proposed framework is confirmed.
Author Takahashi, Atsushi
Kotani, Toshiya
Ihara, Takeshi
Kodama, Chikaaki
Ichikawa, Hirotaka
Nakayama, Koichi
Nojima, Shigeki
Nakajima, Fumiharu
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Keywords Design for manufacturing
self-aligned double patterning (SADP)
routing
lithography
self-aligned quadruple patterning (SAQP)
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Snippet Although self-aligned double and quadruple patterning (SADP, SAQP) have promising processes for sub-20 nm node advanced technologies and beyond, not all...
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StartPage 753
SubjectTerms Color
Design for manufacturing
Layout
Lithography
Materials
Metals
Pins
Routing
self-aligned quadruple patterning (SAQP)
selfaligned double patterning (SADP)
Title Self-Aligned Double and Quadruple Patterning Aware Grid Routing Methods
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Volume 34
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