Self-Aligned Double and Quadruple Patterning Aware Grid Routing Methods
Although self-aligned double and quadruple patterning (SADP, SAQP) have promising processes for sub-20 nm node advanced technologies and beyond, not all layouts are compatible with them. In advanced technologies, feasible wafer image should be generated effectively by utilizing SADP and SAQP where a...
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| Published in | IEEE transactions on computer-aided design of integrated circuits and systems Vol. 34; no. 5; pp. 753 - 765 |
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| Main Authors | , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
IEEE
01.05.2015
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| Subjects | |
| Online Access | Get full text |
| ISSN | 0278-0070 1937-4151 |
| DOI | 10.1109/TCAD.2015.2404878 |
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| Summary: | Although self-aligned double and quadruple patterning (SADP, SAQP) have promising processes for sub-20 nm node advanced technologies and beyond, not all layouts are compatible with them. In advanced technologies, feasible wafer image should be generated effectively by utilizing SADP and SAQP where a wafer image is determined by a selected mandrel pattern. However, predicting a mandrel pattern is not easy since it is different from the wafer image (or target pattern). In this paper, we propose new routing methods for spacer-is-dielectric (SID)-type SADP, SID-type SAQP, and spacer-is-metal (SIM)-type SADP to generate a feasible layout satisfying the connection requirements. Routing algorithms comprising simple connecting and cutting rules are performed on a new grid structure where two (SID-type SADP) or three colors (SID-type SAQP and SIM-type SADP) are assigned alternately to grid-nodes. Then a mandrel pattern is selected without complex coloring or decomposition methods. Also, we try to reduce hotspots (potentially defective regions) by the proposed dummy pattern flipping for SID-type SADP. In experiments, feasible layouts meeting the connection requirements are generated and the effectiveness of the proposed framework is confirmed. |
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| ISSN: | 0278-0070 1937-4151 |
| DOI: | 10.1109/TCAD.2015.2404878 |