Damage detection in bonded repairs using piezoceramics

• Published in: Smart materials and structures Vol. 9; no. 4; pp. 466 - 475
• Main Authors: Chiu, W K, Galea, S C, Koss, L L, Rajic, N
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.08.2000; Institute of Physics
• Subjects: Analysing. Testing. Standards; Applied sciences; Exact sciences and technology; Fracture mechanics (crack, fatigue, damage...); Fracture mechanics, fatigue and cracks; Fundamental areas of phenomenology (including applications); Measurement and testing methods; Measurement methods and techniques in continuum mechanics of solids; Metals. Metallurgy; Nondestructive testing; Physics; Polymer industry, paints, wood; Properties and testing; Solid mechanics; Structural and continuum mechanics; Technology of polymers; Testing and control; Testing for defects; Piezoelectric sensor; In situ test; Surface transducer; Modeling; Finite element method; Lamb wave; Adhesive joint; Polymer metal contact; Measurement method; Transfer function; Localization; Repair; Monitoring; Damaging
• ISSN: 0964-1726; 1361-665X
• DOI: 10.1088/0964-1726/9/4/309

This paper reports on the development of a perceptive repair or smart system which will provide information on the in-service performance of the repair and the associated aerospace structure. In this respect, this paper focuses on the detection of disbond in the adhesive layer between adhered (boron/epoxy unidirectional composite) and the metallic parent (Al) structure. One of the criteria of this smart system is that it must be economical, reliable and, preferably, self-powered. To this end, it was proposed that piezoceramic of piezoelectric material be utilized because of their ease of application. These materials were chosen because they can be used both as a actuator and as a sensor. This paper presents a set of numerical investigations performed to highlight the viability of using this material system, and the associated signal analysis that can be employed to detect the presence or the development of disbonds in the adhesive in a bonded repair situation.