LASIE: Large Area Spectroscopic Imaging Ellipsometry for Characterizing Multi-Layered Film Structures

• Published in: International journal of precision engineering and manufacturing Vol. 19; no. 8; pp. 1125 - 1132
• Main Authors: Kim, Dae Hee, Yun, Young Ho, Joo, Ki-Nam
• Format: Journal Article
• Language: English
• Published: Seoul Korean Society for Precision Engineering 01.08.2018; Springer Nature B.V
• Subjects: Broadband; Engineering; Field of view; Film thickness; Image resolution; Industrial and Production Engineering; Materials Science; Multilayers; Regular Paper; Spectroellipsometry; Spectroscopic ellipsometry; Film thickness measurement; 3D profile measurement; Multi-layered film structure; Large area measurements
• ISSN: 2234-7593; 2005-4602
• DOI: 10.1007/s12541-018-0133-9

In this investigation, we describe a spectroscopic imaging ellipsometry for large area measurements, named as large area spectroscopic ellipsometry (LASIE). LASIE uses a broadband light source and an imaging spectrometer in order to obtain the spectral-spatial intensity images corresponding to a measurement line of a specimen and it can characterize the 3D multi-film structures with the aid of lateral scanning. Opposed to the typical high resolution imaging ellipsometry with the small field of view (FOV), LASIE uses a low magnification imaging lens to enlarge the measurement area and line profiles of multi-layered film structure can be reconstructed at a single operation based on the operation of the spectroscopic imaging spectrometer. In the experiment, 3- and 4-layered film specimen were measured after the system calibration and the 3D film thickness profiles of all film layers were obtained with 1 nm repeatability.