Dip coating with an interaction potential normal to the substrate
Dip coating in the presence of a substrate-liquid interaction potential normal to the substrate, previously theoretically investigated by R. Krechetnikov and G. M. Homsy [ Phys. Fluids 17 , 038101 ( 2005 )] , was revisited. Their solution procedure leads to predictions of the entrained film thicknes...
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          | Published in | Physics of fluids (1994) Vol. 24; no. 2; pp. 022107 - 022107-13 | 
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| Main Author | |
| Format | Journal Article | 
| Language | English | 
| Published | 
        Melville, NY
          American Institute of Physics
    
        01.02.2012
     | 
| Subjects | |
| Online Access | Get full text | 
| ISSN | 1070-6631 1089-7666 1527-2435 1089-7666  | 
| DOI | 10.1063/1.3680872 | 
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| Summary: | Dip coating in the presence of a substrate-liquid interaction potential normal to the substrate, previously theoretically investigated by
R. Krechetnikov
and
G. M. Homsy
[
Phys. Fluids
17
,
038101
(
2005
)]
, was revisited. Their solution procedure leads to predictions of the entrained film thickness
$h_\infty ^*$
h
∞
*
that deviate substantially from the classical Landau-Levich law because of the impossibility to identify meniscus solutions satisfying the proper boundary conditions of zero thickness and zero apparent contact angle on the solid substrate (L-L BC's). In contrast, in the present analysis, by choosing a different method of integration and requiring the satisfaction of the boundary condition of flat bath for large, but finite, meniscus thickness, we obtain solutions subject to L-L BC's for the same parameter range studied in Krechetnikov and Homsy's paper. Thus, the matching follows a modified Landau-Levich law, where
$h_\infty ^*$
h
∞
*
is inversely proportional to the meniscus curvature at the substrate. Since the interaction potential changes considerably this curvature, the entrained film significantly thickens for attractive interactions or thins for repulsive ones. Similar results are also found for a potential of the Debye-Hückel form. | 
|---|---|
| ISSN: | 1070-6631 1089-7666 1527-2435 1089-7666  | 
| DOI: | 10.1063/1.3680872 |