Micromechanics of substrate-supported thin films

• Published in: Acta mechanica Sinica Vol. 34; no. 2; pp. 381 - 391
• Main Authors: He, Wei, Han, Meidong, Wang, Shibin, Li, Lin-An, Xue, Xiuli
• Format: Journal Article
• Language: English
• Published: Beijing The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences 01.04.2018; Springer Nature B.V; Department of Mechanics,Tianjin University, Tianjin 300072,China%Department of Engineering Mechanics,Hunan University of Science and Technology,Xiangtan 411201,China
• Edition: English ed.
• Subjects: Adhesion tests; Bauschinger effect; Classical and Continuum Physics; Computational Intelligence; Deformation effects; Elastic deformation; Elastic properties; Engineering; Engineering Fluid Dynamics; Flexible components; Mechanical properties; Microelectromechanical systems; Micromechanics; Nanoelectromechanical systems; Review Paper; Substrates; Theoretical and Applied Mechanics; Thin films; Thin films; Bauschinger effect; Deformation; Elastic property; Adhesion
• ISSN: 0567-7718; 1614-3116
• DOI: 10.1007/s10409-017-0697-0

The mechanical properties of metallic thin films deposited on a substrate play a crucial role in the performance of micro/nano-electromechanical systems (MEMS/NEMS) and flexible electronics. This article reviews ongoing study on the mechanics of substrate-supported thin films, with emphasis on the experimental characterization techniques, such as the rule of mixture and X-ray tensile testing. In particular, the determination of interfacial adhesion energy, film deformation, elastic properties and Bauschinger effect are discussed.