Coupled effect of tool geometry and tool-particle position on diamond cutting of SiCp/Al

• Published in: Journal of materials processing technology Vol. 303; p. 117510
• Main Authors: Lu, Shijin, Li, Zengqiang, Zhang, Junjie, Zhang, Chunyu, Li, Guo, Zhang, Haijun, Sun, Tao
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.05.2022; Elsevier BV
• Subjects: Contact angle; Contact stresses; Cutting force; Cutting parameters; Cutting tools; Diamond cutting; Diamond machining; Diamond tools; Failure modes; Finite element method; Finite element simulation; Machinability; Machine tools; Mechanical properties; Particle-matrix interfaces; Rake angle; SiCp/Al; Silicon carbide; Stress state; Surface integrity; Tool-particle interaction; Two dimensional models; Rake angle; Surface integrity; SiCp/Al; Tool-particle interaction; Diamond cutting; Finite element simulation
• ISSN: 0924-0136; 1873-4774
• DOI: 10.1016/j.jmatprotec.2022.117510

FE simulation and corresponding experiment of diamond cutting of SiCp/Al demonstrates the fracture modes of SiC particles and their correlations with surface integrity. [Display omitted] •Coupled effect of tool-particle relative position and rake angle of cutting tool on diamond cutting of SiCp/Al is revealed.•FE model of SiCp/Al cutting considers real microstructural characteristics and CZM-based mechanical behavior of interface.•FE simulations of diamond cutting of SiCp/Al yield qualitatively agreed results with experimental data. The stress state built in the tool-particle contact region plays a dominant role in governing the particle-tool interactions that strongly determine the machinability of SiCp/Al. In the present work, we evaluate the coupled influence of rake angle of cutting tool and tool-particle position on the ultra-precision diamond cutting of SiCp/Al by finite element simulations and corresponding experiments. Specifically, 2D finite element modeling of SiCp/Al cutting with the consideration of the real microstructural characteristics of SiC particles and the mechanical behavior of particle-matrix interface is caried out, and the accuracy of which is verified by corresponding cutting experiments. Simulation results and experimental data jointly reveal different failure modes of SiC particles, as well as their correlations with cutting force, chip profile and machined surface integrity. In particular, the rake angle of cutting tool significantly alters the built stress state in tool-particle contact region, thus leading to a strong coupled effect of rake angle of cutting tool and tool-particle position on the diamond cutting of SiCp/Al. The findings reported in this work provide a theoretical basis for the rational selection of geometrical parameters of cutting tool for promoting the machinability of SiCp/Al.