Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method
[Display omitted] •Porous boron-nitride/polyimide (BN/PI) composites are fabricated via high internal phase Pickering emulsion (HIPPE).•BN nanoparticles were uniformly dispersed on the surface of porous PI skeleton.•3D-connected BN nanoparticles on the surface of PI skeleton act as an efficient heat...
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| Published in | Journal of industrial and engineering chemistry (Seoul, Korea) Vol. 82; pp. 173 - 179 |
|---|---|
| Main Authors | , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
25.02.2020
한국공업화학회 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1226-086X 1876-794X |
| DOI | 10.1016/j.jiec.2019.10.010 |
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| Abstract | [Display omitted]
•Porous boron-nitride/polyimide (BN/PI) composites are fabricated via high internal phase Pickering emulsion (HIPPE).•BN nanoparticles were uniformly dispersed on the surface of porous PI skeleton.•3D-connected BN nanoparticles on the surface of PI skeleton act as an efficient heat transfer path.•Internal porous structure of BN/PI composite films enable to exhibit the extremely low dielectric properties.
This work offers a simple fabrication of porous boron-nitride-(BN)/polyimide-(PI) composite films with high thermal diffusivities and low dielectric constants by combining high-internal-phase Pickering emulsification (HIPPE) and subsequent hot-pressing. BN nanoparticles in composite foams were well dispersed and three-dimensionally connected following the surface of the PI skeleton used as the polymer matrix. The BN contents in the BN/PI composite foams were adjusted in the range of 20–80wt%. The porosities of the composite films were controlled according to the hot-pressing conditions such as the temperature. The porous BN/PI composite films exhibited high thermal diffusivities of 0.059–1.033mm2/s and low dielectric constants of 2.08–3.48 at 1GHz for BN contents of 20–80wt%. In particular, the BN/PI composite films had extremely low dielectric loss values, close to zero (<0.002) at high frequencies regardless of the BN content and pressing conditions. |
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| AbstractList | [Display omitted]
•Porous boron-nitride/polyimide (BN/PI) composites are fabricated via high internal phase Pickering emulsion (HIPPE).•BN nanoparticles were uniformly dispersed on the surface of porous PI skeleton.•3D-connected BN nanoparticles on the surface of PI skeleton act as an efficient heat transfer path.•Internal porous structure of BN/PI composite films enable to exhibit the extremely low dielectric properties.
This work offers a simple fabrication of porous boron-nitride-(BN)/polyimide-(PI) composite films with high thermal diffusivities and low dielectric constants by combining high-internal-phase Pickering emulsification (HIPPE) and subsequent hot-pressing. BN nanoparticles in composite foams were well dispersed and three-dimensionally connected following the surface of the PI skeleton used as the polymer matrix. The BN contents in the BN/PI composite foams were adjusted in the range of 20–80wt%. The porosities of the composite films were controlled according to the hot-pressing conditions such as the temperature. The porous BN/PI composite films exhibited high thermal diffusivities of 0.059–1.033mm2/s and low dielectric constants of 2.08–3.48 at 1GHz for BN contents of 20–80wt%. In particular, the BN/PI composite films had extremely low dielectric loss values, close to zero (<0.002) at high frequencies regardless of the BN content and pressing conditions. Thiswork offers a simple fabrication ofporousboron-nitride-(BN)/polyimide-(PI) compositefilms withhighthermal diffusivities and low dielectric constants by combining high-internal-phase Pickering emulsification(HIPPE) and subsequent hot-pressing. BN nanoparticles in composite foams were well dispersed andthree-dimensionally connected following the surface of the PI skeleton used as the polymer matrix. The BNcontents in the BN/PI composite foams were adjusted in the range of 20–80 wt%. The porosities of thecompositefilms were controlled according to the hot-pressing conditions such as the temperature. Theporous BN/PI compositefilms exhibited high thermal diffusivities of 0.059–1.033 mm2/s and low dielectricconstants of 2.08–3.48 at 1 GHz for BN contents of 20–80 wt%. In particular, the BN/PI compositefilms hadextremely low dielectric loss values, close to zero (<0.002) at high frequencies regardless of the BN contentand pressing conditions. KCI Citation Count: 13 |
| Author | Yang, Kwansoo Choi, Siyoung Q. Ahn, Hyun Jeong Park, No Kyun Kim, Dong-Gyun Won, Jong Chan Kim, Yun Ho Kang, Yi Young |
| Author_xml | – sequence: 1 givenname: Kwansoo surname: Yang fullname: Yang, Kwansoo organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea – sequence: 2 givenname: Yi Young surname: Kang fullname: Kang, Yi Young organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea – sequence: 3 givenname: Hyun Jeong surname: Ahn fullname: Ahn, Hyun Jeong organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea – sequence: 4 givenname: Dong-Gyun orcidid: 0000-0003-0384-0067 surname: Kim fullname: Kim, Dong-Gyun organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea – sequence: 5 givenname: No Kyun surname: Park fullname: Park, No Kyun organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea – sequence: 6 givenname: Siyoung Q. orcidid: 0000-0002-6020-3091 surname: Choi fullname: Choi, Siyoung Q. organization: Department of Chemical and Biomolecular Engineering, KAIST, Daejeon 34141, Republic of Korea – sequence: 7 givenname: Jong Chan surname: Won fullname: Won, Jong Chan email: jcwon@krict.re.kr organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea – sequence: 8 givenname: Yun Ho orcidid: 0000-0002-1722-5623 surname: Kim fullname: Kim, Yun Ho email: yunho@krict.re.kr organization: Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea |
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•Porous boron-nitride/polyimide (BN/PI) composites are fabricated via high internal phase Pickering emulsion (HIPPE).•BN nanoparticles were... Thiswork offers a simple fabrication ofporousboron-nitride-(BN)/polyimide-(PI) compositefilms withhighthermal diffusivities and low dielectric constants by... |
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| SubjectTerms | High thermal diffusivity High-internal-phase Pickering emulsion Low dielectric constant Polymer composite 화학공학 |
| Title | Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method |
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