Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method

• Published in: Journal of industrial and engineering chemistry (Seoul, Korea) Vol. 82; pp. 173 - 179
• Main Authors: Yang, Kwansoo, Kang, Yi Young, Ahn, Hyun Jeong, Kim, Dong-Gyun, Park, No Kyun, Choi, Siyoung Q., Won, Jong Chan, Kim, Yun Ho
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 25.02.2020; 한국공업화학회
• Subjects: High thermal diffusivity; High-internal-phase Pickering emulsion; Low dielectric constant; Polymer composite; 화학공학; Low dielectric constant; High thermal diffusivity; High-internal-phase Pickering emulsion; Polymer composite
• ISSN: 1226-086X; 1876-794X
• DOI: 10.1016/j.jiec.2019.10.010

[Display omitted] •Porous boron-nitride/polyimide (BN/PI) composites are fabricated via high internal phase Pickering emulsion (HIPPE).•BN nanoparticles were uniformly dispersed on the surface of porous PI skeleton.•3D-connected BN nanoparticles on the surface of PI skeleton act as an efficient heat transfer path.•Internal porous structure of BN/PI composite films enable to exhibit the extremely low dielectric properties. This work offers a simple fabrication of porous boron-nitride-(BN)/polyimide-(PI) composite films with high thermal diffusivities and low dielectric constants by combining high-internal-phase Pickering emulsification (HIPPE) and subsequent hot-pressing. BN nanoparticles in composite foams were well dispersed and three-dimensionally connected following the surface of the PI skeleton used as the polymer matrix. The BN contents in the BN/PI composite foams were adjusted in the range of 20–80wt%. The porosities of the composite films were controlled according to the hot-pressing conditions such as the temperature. The porous BN/PI composite films exhibited high thermal diffusivities of 0.059–1.033mm2/s and low dielectric constants of 2.08–3.48 at 1GHz for BN contents of 20–80wt%. In particular, the BN/PI composite films had extremely low dielectric loss values, close to zero (<0.002) at high frequencies regardless of the BN content and pressing conditions.