Recent Advances in Electroplating of Through-Hole Copper Interconnection

• Published in: Electrocatalysis Vol. 12; no. 6; pp. 619 - 627
• Main Authors: Zhang, Yuanhang, An, Maozhong, Yang, Peixia, Zhang, Jinqiu
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.11.2021; Springer Nature B.V
• Subjects: Additives; Catalysis; Chemistry; Chemistry and Materials Science; Circuit boards; Electrochemistry; Electroplating; Energy Systems; Mathematical models; Multilayers; Numerical models; Physical Chemistry; Plating; Plating baths; Printed circuits; Review Articles; Through hole; Additive; Simulation; Periodic pulse reverse electroplating; Copper interconnection
• ISSN: 1868-2529; 1868-5994
• DOI: 10.1007/s12678-021-00687-2

With the gradual development of high density and high integration of printed circuit board (PCB), the electroplating technology of PCB has been widely paid attention by researchers and enterprises, among which the through-hole (TH) electroplating of PCB is the key to realize the multi-layer interconnection. Many researches improve the electroplating quality of TH by optimizing the technological conditions. In this paper, the development trend and challenges of TH electroplating are introduced. In addition, the research mechanism of TH electroplating as well as the influence of additives and periodic pulse reverse electroplating on TH electroplating are also introduced. In addition, the methods of studying the electroplating process through numerical model and optimizing the electroplating process are analyzed and summarized. By adding additives to the bath and deeply studying the mechanism of TH electroplating through numerical simulation, the technological parameters of TH interconnection were optimized. The research status of TH electroplating was reviewed. The deposition mechanism was studied by theoretical calculation method and the electrode process was changed by using additives to improve the quality of TH electroplating. Graphical abstract