Application of the non-uniform FDTD algorithm on an auto-adjustable mesh to the analysis of scattering parameters of a sandwiched-type coplanar waveguide with adjacent vias in PCBs

• Published in: International journal of electronics Vol. 89; no. 10; pp. 791 - 800
• Main Authors: Chen, Yinchao, Yang, Mingwu, Sun, Kunquan, Mittra, Raj
• Format: Journal Article
• Language: English
• Published: London Taylor & Francis Group 01.10.2002; Taylor & Francis
• Subjects: Applied sciences; Circuit properties; Electric, optical and optoelectronic circuits; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Integrated optics. Optical fibers and wave guides; Optical and optoelectronic circuits; Electromagnetic wave scattering; Parametric analysis; Characteristic impedance; s parameter; Sandwich structure; Finite difference time-domain analysis; Printed circuit board; Numerical method; Coplanar waveguides; Mesh method; Via hole
• ISSN: 0020-7217; 1362-3060
• DOI: 10.1080/0020721031000084444

In this paper, we analyse scattering parameters for a sandwiched-type coplanar waveguide (SCPW) with three pairs of vias that are adjacent to each other. The above structure is frequently encountered in printed circuit board (PCB) designs, and is analysed by using a non-uniform finite difference time domain (FDTD) algorithm on an auto-adjustable mesh. The mesh generator developed for this algorithm can efficiently generate the files for the geometry-as well as for the material parameters-that serve as the inputs to the non-uniform FDTD solver. In addition, the generator has numerous graphical functions that not only ensure accuracy of generated data files but also make them convenient for the user. We carry out an extensive parametric study and show that the S -parameters are very dependent on the geometrical parameters of the vias, especially at high frequencies.