Improvement of the off-state breakdown voltage with field plate and low-density drain in AlGaN/GaN high-electron mobility transistors

We present an AlGaN/GaN high-electron mobility transistor(HEMT) device with both field plate(FP) and lowdensity drain(LDD). The LDD is realized by the injection of negatively charged fluorine(F-) ions under low power in the space between the gate and the drain electrodes. With a small-size FP and a...

Full description

Saved in:
Bibliographic Details
Published inChinese physics B Vol. 24; no. 3; pp. 332 - 335
Main Author 张鹏 赵胜雷 侯斌 王冲 郑雪峰 马晓华 张进成 郝跃
Format Journal Article
LanguageEnglish
Published 01.03.2015
Subjects
Online AccessGet full text
ISSN1674-1056
2058-3834
1741-4199
DOI10.1088/1674-1056/24/3/037304

Cover

More Information
Summary:We present an AlGaN/GaN high-electron mobility transistor(HEMT) device with both field plate(FP) and lowdensity drain(LDD). The LDD is realized by the injection of negatively charged fluorine(F-) ions under low power in the space between the gate and the drain electrodes. With a small-size FP and a LDD length equal to only 31% of the gate-drain spacing, the device effectively modifies the electric field distribution and achieves a breakdown voltage enhancement up to two times when compared with a device with only FP.
Bibliography:GaN,high-electron mobility transistors,fluorine,electric field
We present an AlGaN/GaN high-electron mobility transistor(HEMT) device with both field plate(FP) and lowdensity drain(LDD). The LDD is realized by the injection of negatively charged fluorine(F-) ions under low power in the space between the gate and the drain electrodes. With a small-size FP and a LDD length equal to only 31% of the gate-drain spacing, the device effectively modifies the electric field distribution and achieves a breakdown voltage enhancement up to two times when compared with a device with only FP.
11-5639/O4
Zhang Peng, Zhao Sheng-Lei, Hou Bin, Wang Chong, Zheng Xue-Feng, Ma Xiao-Hua, Zhang Jin-Cheng, and Hao Yue( Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, School of Advanced Materials and Nanotechnology, Xidian University, Xi' an 710071, China)
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1674-1056
2058-3834
1741-4199
DOI:10.1088/1674-1056/24/3/037304