Effect of Pt diffusion barrier layer in Ni/AuGe/Pt/Au on ohmic contact to n-GaAs
The multi-layer metals of Ni/AuGe/Pt/Au with a Pt diffusion barrier layer of ohmic contact to n-GaAs were studied. The surface morphology and ohmic contact resistivity of multi-layer metals were characterized, with and without the Pt diffusion barrier layer for comparison. The SEM and EDS measuremen...
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Published in | Journal of semiconductors Vol. 36; no. 3; pp. 141 - 143 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
01.03.2015
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ISSN | 1674-4926 |
DOI | 10.1088/1674-4926/36/3/036002 |
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Abstract | The multi-layer metals of Ni/AuGe/Pt/Au with a Pt diffusion barrier layer of ohmic contact to n-GaAs were studied. The surface morphology and ohmic contact resistivity of multi-layer metals were characterized, with and without the Pt diffusion barrier layer for comparison. The SEM and EDS measurements show the Pt diffusion barrier layer can block the interdiffusion of atoms in multi-layer metals, and improve the surface morphology. The TLM results show that the samples with a Pt diffusion barrier layer have uniform ohmic contact resistance, indicating that the Pt diffusion barrier layer can increase the repetition and uniformity of ohmic contact to n-GaAs, and improve the thermal stability and reliability of GaAs-based devices. |
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AbstractList | The multi-layer metals of Ni/AuGe/Pt/Au with a Pt diffusion barrier layer of ohmic contact to n-GaAs were studied. The surface morphology and ohmic contact resistivity of multi-layer metals were characterized, with and without the Pt diffusion barrier layer for comparison. The SEM and EDS measurements show the Pt diffusion barrier layer can block the interdiffusion of atoms in multi-layer metals, and improve the surface morphology. The TLM results show that the samples with a Pt diffusion barrier layer have uniform ohmic contact resistance, indicating that the Pt diffusion barrier layer can increase the repetition and uniformity of ohmic contact to n-GaAs, and improve the thermal stability and reliability of GaAs-based devices. |
Author | 王勇 刘丹丹 冯国庆 叶镇 高占琦 王晓华 |
AuthorAffiliation | National Key Laboratory on High Power Semiconductor Lasers, Changchun University of Science and Technology, Changchun130022, China |
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Cites_doi | 10.1063/1.327387 10.1016/0038-1101(67)90037-8 10.3788/CJL201239.0102010 10.1016/0040-6090(83)90581-3 10.1016/0038-1098(84)90571-4 10.1017/hpl.2013.22 10.1149/1.2096412 10.1016/0038-1101(87)90112-2 10.1364/PRJ.1.000052 10.1017/hpl.2013.6 10.3788/COL20090710.0956 |
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DocumentTitleAlternate | Effect of Pt diffusion barrier layer in Ni/AuGe/Pt/Au on ohmic contact to n-GaAs |
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Notes | GaAs; ohmic contact; diffusion barrier layer 11-5781/TN The multi-layer metals of Ni/AuGe/Pt/Au with a Pt diffusion barrier layer of ohmic contact to n-GaAs were studied. The surface morphology and ohmic contact resistivity of multi-layer metals were characterized, with and without the Pt diffusion barrier layer for comparison. The SEM and EDS measurements show the Pt diffusion barrier layer can block the interdiffusion of atoms in multi-layer metals, and improve the surface morphology. The TLM results show that the samples with a Pt diffusion barrier layer have uniform ohmic contact resistance, indicating that the Pt diffusion barrier layer can increase the repetition and uniformity of ohmic contact to n-GaAs, and improve the thermal stability and reliability of GaAs-based devices. Wang Yong, Liu Dandan, Feng Guoqing, Ye Zhen, Gao Zhanqi, Wang Xiaohua ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
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References | 11 12 Zhang W R (16) 2000; 21 13 Chen T S (15) 1994; 14 Liu F Y (1) 2000; 10 17 Koop E J (14) 2013; 28 Ge J H (2) 2003; 1 Wang Y H (19) 3 4 Yang L J (18) 2007; 27 5 6 8 9 Cao S S (7) 2000; 24 10 |
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SubjectTerms | Contact resistance Diffusion barriers Gold Morphology Multilayers Nickel Platinum Semiconductors 多层金属 扩散阻挡层 欧姆接触电阻 表面形态 金属带 铂 |
Title | Effect of Pt diffusion barrier layer in Ni/AuGe/Pt/Au on ohmic contact to n-GaAs |
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