Modelling of spall damage in ductile materials and its application to the simulation of the plate impact on copper

A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, the elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based...

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Bibliographic Details
Published inChinese physics B Vol. 21; no. 9; pp. 378 - 384
Main Author 张凤国 周洪强 胡军 邵建立 张广财 洪滔 何斌
Format Journal Article
LanguageEnglish
Published 01.09.2012
Subjects
COMPUTER SIMULATION
Copper
Damage
DUCTILITY
Evolution
IMPACT PROPERTIES
Loads (forces)
MATHEMATICAL ANALYSIS
Mathematical models
PLATE
SPALLING
STRESS
Stresses
VOIDS
剥落
实验模拟
平板
应用
损坏
统计模型
铜靶
韧性材料
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ISSN1674-1056
2058-3834
1741-4199
DOI10.1088/1674-1056/21/9/094601

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Summary:A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, the elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based on this model, the simulation of spall experiments for copper is performed by using the Lagrangian finite element method. The simulation results are in good agreement with experimental data for the free surface velocity profile, stress record behind copper target, final porosity, and void concentrations across the target. The influence of elastic-plastic effect upon the damage evolution is explored. The correlation between the damage evolution and the history of the stress near the spall plane is also analyzed.
Bibliography:spall damage, ductile materials, free surface velocity, plate impact
Zhang Feng-Guo, Zhou Hong-Qiang, Hu Jun, Shao Jian-Li, Zhang Guang-Ca, Hong Tao, and He Bin Institute of Applied Physics and Computational Mathematics, Beijing 100094, China
11-5639/O4
A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, the elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based on this model, the simulation of spall experiments for copper is performed by using the Lagrangian finite element method. The simulation results are in good agreement with experimental data for the free surface velocity profile, stress record behind copper target, final porosity, and void concentrations across the target. The influence of elastic-plastic effect upon the damage evolution is explored. The correlation between the damage evolution and the history of the stress near the spall plane is also analyzed.
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ISSN:1674-1056
2058-3834
1741-4199
DOI:10.1088/1674-1056/21/9/094601