Optimization of process conditions for the transfer molding of electronic packages

Transfer molding is used extensively in electronic packaging. To achieve a high production rate and high molding quality, it is necessary to have strict control on the epoxy resin characteristics as well as identify the optimal process conditions of the transfer molding. In this paper, process simul...

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Bibliographic Details
Published inJournal of materials processing technology Vol. 138; no. 1; pp. 361 - 365
Main Authors Tong, K.W, Kwong, C.K, Ip, K.W
Format Journal Article
LanguageEnglish
Published Elsevier B.V 20.07.2003
Subjects
Electronic packages
Process condition
Process simulation
Taguchi method
TOPSIS
Transfer molding
Transfer molding
Electronic packages
TOPSIS
Process condition
Process simulation
Taguchi method
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ISSN0924-0136
DOI10.1016/S0924-0136(03)00099-2

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Summary:Transfer molding is used extensively in electronic packaging. To achieve a high production rate and high molding quality, it is necessary to have strict control on the epoxy resin characteristics as well as identify the optimal process conditions of the transfer molding. In this paper, process simulations of transfer molding for electronic packages were conducted according to Taguchi experiments. The simulation results were then used to derive quality indexes by using TOPSIS (techniques for order preference by similarity of ideal solution) algorithm. Through the analysis of the quality indexes, optimal process conditions can be identified. Two verification tests were carried out and results of the tests are found very close to the predictions. This project has demonstrated that numerical simulation combining with Taguchi method and TOPSIS can be a useful tool for optimization of process conditions for transfer molding of electronic packages.
ISSN:0924-0136
DOI:10.1016/S0924-0136(03)00099-2