A 120-Gb/s 100-145-GHz 16-QAM Dual-Band Dielectric Waveguide Interconnect With Package Integrated Diplexers in Intel 16

This letter presents a dual-band superheterodyne transceiver system in Intel 16 operating at 109 and 135 GHz center frequencies with a measured rejection >60 dB within the 11 GHz guard band. The transceiver is flip-chip assembled on a multilayer organic package, which integrates hairpin resonator...

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Published inIEEE solid-state circuits letters Vol. 5; pp. 178 - 181
Main Authors Dogiamis, Georgios C., Brown, Thomas W., Prabhu Gaunkar, Neelam, Nam, Ye Seul, Rane, Triveni S., Ravikumar, Surej, Neeli, Vijaya B., Chou, Jessica C., Rami, Said, Swan, Johanna
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN2573-9603
2573-9603
DOI10.1109/LSSC.2022.3191526

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Summary:This letter presents a dual-band superheterodyne transceiver system in Intel 16 operating at 109 and 135 GHz center frequencies with a measured rejection >60 dB within the 11 GHz guard band. The transceiver is flip-chip assembled on a multilayer organic package, which integrates hairpin resonator diplexers and electromagnetic waveguide launchers. A connector assembled on the organic package feeds a 3-4-m long PTFE dielectric waveguide ensuring a stable mechanical connection. This letter demonstrates up to 120 Gb/s data rates with measured error vector magnitudes (EVMs) between −19.2 dB and −16.2 dB at 3-4-m distances with combined power consumption of 1116 mW. This is the first work in the literature reporting beyond 60 Gb/s over dielectric waveguide channels at link distances greater than 1 m. Combining frequency division multiplexing with a low tap count FFE equalizer and sharp on-die analog and RF filtering with a low loss on package diplexer enabled the >100 Gb/s at multimeter distances.
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ISSN:2573-9603
2573-9603
DOI:10.1109/LSSC.2022.3191526