The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device
The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is p...
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Published in | Journal of semiconductors Vol. 34; no. 8; pp. 74 - 78 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
01.08.2013
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Subjects | |
Online Access | Get full text |
ISSN | 1674-4926 |
DOI | 10.1088/1674-4926/34/8/084007 |
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Abstract | The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is proposed based on the results.Then,failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. |
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AbstractList | The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is proposed based on the results.Then,failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. The human body model (HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge, including current waveforms and peak current under varied stress voltage and device failure voltage. A new discharge model called the "sparkover-induced model" is proposed based on the results. Then, failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. |
Author | 李松 曾传滨 罗家俊 韩郑生 |
AuthorAffiliation | Institute of Microeletronics, Chinese Academy of Sciences, Beijing 100029, China |
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Cites_doi | 10.1109/TDMR.2004.824362 |
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DocumentTitleAlternate | The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device |
EndPage | 78 |
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Notes | electrostatic discharge human body model no-connect metal cover sparkover 11-5781/TN The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is proposed based on the results.Then,failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. Li Song, Zeng Chuanbin, Luo Jiajun, and Han Zhengsheng Institute of Microeletronics, Chinese Academy of Sciences, Beijing 100029, China ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
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PublicationTitle | Journal of semiconductors |
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References | (3) 2010 (10) 2009 Muhonen K (12) 2009 (4) 2011 (11) 2009 Karp J (13) 2008 Kaschani K T (7) 2006 (9) 2008 2 Fang R (1) 2012 (8) 2009 5 Kunz H (6) 2006 |
References_xml | – year: 2008 ident: 9 publication-title: IEC 61000-4-2: electromagnetic compatibility(emc)–part 4-2: testing and measurement techniques-electrostatic discharge immunity test – year: 2009 ident: 10 publication-title: Field-induced charged-device model test method for electrostatic-discharge-withstand thresholds of microelectronic components – ident: 5 doi: 10.1109/TDMR.2004.824362 – start-page: 84 year: 2012 ident: 1 publication-title: Sci. Technol. Association Forum – year: 2010 ident: 3 publication-title: MIL-STD-883H – year: 2011 ident: 4 publication-title: ESDA/JEDEC joint standard for electrostatic discharge sensitivity testing-human body model (HBM)-component level – year: 2009 ident: 11 publication-title: ESD association standard for electrostatic discharge sensitivity testing-charged device model (CDM)–component level – year: 2008 ident: 13 – ident: 2 publication-title: Inspection criteria for microelectronic packages and covers – year: 2006 ident: 6 – year: 2006 ident: 7 – year: 2009 ident: 12 – year: 2009 ident: 8 publication-title: ESD association technical report for the protection of electrostatic discharge susceptible items-human metal model (HMM) |
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Snippet | The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current... The human body model (HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge, including current... |
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SubjectTerms | Devices Electric potential Electrostatic discharges Semiconductors Sparkover Stresses Threshold voltage Voltage 异常 故障电压 无连接 火花放电 移动设备 金属板 陶瓷封装 静电放电 |
Title | The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device |
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