The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device
The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is p...
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Published in | Journal of semiconductors Vol. 34; no. 8; pp. 74 - 78 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
01.08.2013
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Subjects | |
Online Access | Get full text |
ISSN | 1674-4926 |
DOI | 10.1088/1674-4926/34/8/084007 |
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Summary: | The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is proposed based on the results.Then,failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. |
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Bibliography: | electrostatic discharge human body model no-connect metal cover sparkover 11-5781/TN The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is proposed based on the results.Then,failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. Li Song, Zeng Chuanbin, Luo Jiajun, and Han Zhengsheng Institute of Microeletronics, Chinese Academy of Sciences, Beijing 100029, China ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 1674-4926 |
DOI: | 10.1088/1674-4926/34/8/084007 |