韩郑生, 李. 曾. 罗. (2013). The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device. Journal of semiconductors, 34(8), 74-78. https://doi.org/10.1088/1674-4926/34/8/084007
Chicago Style (17th ed.) Citation韩郑生, 李松 曾传滨 罗家俊. "The Abnormal Electrostatic Discharge of a No-connect Metal Cover in a Ceramic Packaging Device." Journal of Semiconductors 34, no. 8 (2013): 74-78. https://doi.org/10.1088/1674-4926/34/8/084007.
MLA (9th ed.) Citation韩郑生, 李松 曾传滨 罗家俊. "The Abnormal Electrostatic Discharge of a No-connect Metal Cover in a Ceramic Packaging Device." Journal of Semiconductors, vol. 34, no. 8, 2013, pp. 74-78, https://doi.org/10.1088/1674-4926/34/8/084007.
Warning: These citations may not always be 100% accurate.