Current detection circuit in multiple parallel connection circuit of high‐power semiconductor modules

We are developing current‐detection technology that directly measures the main current of a high‐power semiconductor module using the wiring inductance of the module. In a previous study, we proposed a circuit that detects current by integrating the voltage generated in the wiring inductance between...

Full description

Saved in:
Bibliographic Details
Published inElectrical engineering in Japan Vol. 214; no. 4
Main Authors Katoh, Miyu, Nagasu, Masahiro, Suzuki, Sosuke, Inaba, Masamitsu, Ishikawa, Katsumi
Format Journal Article
LanguageEnglish
Published Hoboken Wiley Subscription Services, Inc 01.12.2021
Subjects
Online AccessGet full text
ISSN0424-7760
1520-6416
DOI10.1002/eej.23351

Cover

More Information
Summary:We are developing current‐detection technology that directly measures the main current of a high‐power semiconductor module using the wiring inductance of the module. In a previous study, we proposed a circuit that detects current by integrating the voltage generated in the wiring inductance between the sense emitter and emitter terminals of the IGBT (Insulated Gate Bipolar Transistor) module. In this study, we developed a total current detection scheme for parallel‐connected modules. The basic principle of this scheme is that the total current can be obtained by the total of each voltage generated on the wiring inductance of each module. It was realized by using only one integrating circuit. A challenge for this study was avoiding reflection caused by impedance mismatch. We addressed this by adding a termination resistance with the same value as the characteristic impedance.
Bibliography:Denki Gakkai Ronbunshi D
Translated from Volume 141 Number 7, pages 542–551, DOI: 10.1541/ieejias.141.542 of
IEEJ Transactions on Industry Applications
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:0424-7760
1520-6416
DOI:10.1002/eej.23351