Integrated readout electronics for Belle II pixel detector

This paper describes the readout components for Belle II that have been designed as integrated circuits. The ICs are connected to DEPFET sensor by bump bonding. Three types of ICs have been developed: SWITCHER for pixel matrix control, DCD for readout and digitizing of sensor signals and DHP for dig...

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Bibliographic Details
Published inJournal of instrumentation Vol. 13; no. 3; p. C03001
Main Authors Blanco, R., Leys, R., Perić, I.
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 05.03.2018
Subjects
Circuit design
Data processing
Differential amplifiers
Digital data
Digitization
Integrated circuits
Pixels
Signal processing
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ISSN1748-0221
1748-0221
DOI10.1088/1748-0221/13/03/C03001

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Summary:This paper describes the readout components for Belle II that have been designed as integrated circuits. The ICs are connected to DEPFET sensor by bump bonding. Three types of ICs have been developed: SWITCHER for pixel matrix control, DCD for readout and digitizing of sensor signals and DHP for digital data processing. The ICs are radiation tolerant and use several novel features, such as the multiple-input differential amplifiers and the fast and radiation hard high-voltage drivers. SWITCHER and DCD have been developed at University of Heidelberg, Karlsruhe Institute of Technology (KIT) and DHP at Bonn University. The IC-development started in 2009 and was accomplished in 2016 with the submissions of final designs. The final ICs for Belle II pixel detector and the related measurement results will be presented in this contribution.
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ISSN:1748-0221
1748-0221
DOI:10.1088/1748-0221/13/03/C03001