Analysis of Electroless Copper Plating Baths by Isotachophoresis

Simultaneous analysis of EDTA (complexing agent), Cu-EDTA (copper complex of EDTA) and formate (oxidation product of formaldehyde) contained in copper plating baths used in the full-additive process was carried out within 20 minutes, by isotachophoresis using hydrochloric acid and histidine (pH 6.0)...

Full description

Saved in:
Bibliographic Details
Published inJournal of the Metal Finishing Society of Japan Vol. 37; no. 4; pp. 195 - 199
Main Authors KOJIMA, Kayoko, YAGI, Takao, SHINOHARA, Nagamasa
Format Journal Article
LanguageJapanese
Published The Surface Finishing Society of Japan 01.01.1986
Online AccessGet full text
ISSN0026-0614
1884-3395
1884-3395
DOI10.4139/sfj1950.37.195

Cover

More Information
Summary:Simultaneous analysis of EDTA (complexing agent), Cu-EDTA (copper complex of EDTA) and formate (oxidation product of formaldehyde) contained in copper plating baths used in the full-additive process was carried out within 20 minutes, by isotachophoresis using hydrochloric acid and histidine (pH 6.0) as the leading electrolyte and sodium caproate as the terminal electrolyte. Free copper ions were not detected. Gas chromatography showed that the formaldehyde decreased in proportion to the increase of formate. This shows that isotachophoresis can be used to monitor the concentration of the reducing agent (formaldehyde) in a copper plating bath. Several amines and amino acids added to the copper plating bath were also determined.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0026-0614
1884-3395
1884-3395
DOI:10.4139/sfj1950.37.195