USAMI, M., KOHNO, A., HORINO, M., TASE, T., TOKUDA, M., & SASAKI, Y. (1998). Defect Rescue Method for Microprocessor, Using Bonding Technology with Ar Atom Bombardment. QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 16(2), 264-271. https://doi.org/10.2207/qjjws.16.264
Chicago Style (17th ed.) CitationUSAMI, Mitsuo, Akiomi KOHNO, Masaya HORINO, Takashi TASE, Masahide TOKUDA, and Yasuhiko SASAKI. "Defect Rescue Method for Microprocessor, Using Bonding Technology with Ar Atom Bombardment." QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 16, no. 2 (1998): 264-271. https://doi.org/10.2207/qjjws.16.264.
MLA (9th ed.) CitationUSAMI, Mitsuo, et al. "Defect Rescue Method for Microprocessor, Using Bonding Technology with Ar Atom Bombardment." QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, vol. 16, no. 2, 1998, pp. 264-271, https://doi.org/10.2207/qjjws.16.264.