Convenient Debonding Strength Evaluation Based on the Intensity of Singular Stress for Adhesive Joints
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| Published in | Journal of The Japan Institute of Electronics Packaging |
|---|---|
| Format | Journal Article |
| Language | English Japanese |
| Published |
01.03.2014
|
| Online Access | Get full text |
| ISSN | 1343-9677 1884-121X |
| DOI | 10.5104/jiep.17.132 |
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| ISSN: | 1343-9677 1884-121X |
|---|---|
| DOI: | 10.5104/jiep.17.132 |