An Evaluation of the Adhesive Toughness of Cu Thin Film on Si Substrate

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Bibliographic Details
Published inZairyo
Format Journal Article
LanguageEnglish
Japanese
Online AccessGet full text
ISSN0514-5163
1880-7488
DOI10.2472/jsms.53.846

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ISSN:0514-5163
1880-7488
DOI:10.2472/jsms.53.846