IFRA instruction footprint recording and analysis for post-silicon bug localization in processors
The objective of IFRA, Instruction Footprint Recording and Analysis, is to overcome the challenges associated with a very expensive step in post-silicon validation of processors -- bug localization in a system setup. IFRA consists of special design and analysis techniques required to bridge a major...
Saved in:
| Published in | 2008 45th ACM/IEEE Design Automation Conference pp. 373 - 378 |
|---|---|
| Main Authors | , |
| Format | Conference Proceeding |
| Language | English |
| Published |
New York, NY, USA
ACM
08.06.2008
IEEE |
| Series | ACM Conferences |
| Subjects | |
| Online Access | Get full text |
| ISBN | 1605581151 9781605581156 |
| ISSN | 0738-100X |
| DOI | 10.1145/1391469.1391569 |
Cover
| Summary: | The objective of IFRA, Instruction Footprint Recording and Analysis, is to overcome the challenges associated with a very expensive step in post-silicon validation of processors -- bug localization in a system setup. IFRA consists of special design and analysis techniques required to bridge a major gap between system-level and circuit-level debug. Special hardware recorders, called Footprint Recording Structures (FRS's), record semantic information about data and control flows of instructions passing through various design blocks of a processor. This information is recorded concurrently during normal operation of a processor in a post-silicon system validation setup. Upon detection of a problem, the recorded information is scanned out and analyzed for bug localization. Special program analysis techniques, together with the binary of the application executed during post-silicon validation, are used for the analysis. IFRA does not require full system-level reproduction of bugs or system-level simulation. Simulation results on a complex super-scalar processor demonstrate that IFRA is effective in accurately localizing bugs with very little impact on overall chip area. |
|---|---|
| ISBN: | 1605581151 9781605581156 |
| ISSN: | 0738-100X |
| DOI: | 10.1145/1391469.1391569 |