IFRA instruction footprint recording and analysis for post-silicon bug localization in processors
The objective of IFRA, Instruction Footprint Recording and Analysis, is to overcome the challenges associated with a very expensive step in post-silicon validation of processors -- bug localization in a system setup. IFRA consists of special design and analysis techniques required to bridge a major...
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          | Published in | 2008 45th ACM/IEEE Design Automation Conference pp. 373 - 378 | 
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| Main Authors | , | 
| Format | Conference Proceeding | 
| Language | English | 
| Published | 
        New York, NY, USA
          ACM
    
        08.06.2008
     IEEE  | 
| Series | ACM Conferences | 
| Subjects | |
| Online Access | Get full text | 
| ISBN | 1605581151 9781605581156  | 
| ISSN | 0738-100X | 
| DOI | 10.1145/1391469.1391569 | 
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| Summary: | The objective of IFRA, Instruction Footprint Recording and Analysis, is to overcome the challenges associated with a very expensive step in post-silicon validation of processors -- bug localization in a system setup. IFRA consists of special design and analysis techniques required to bridge a major gap between system-level and circuit-level debug. Special hardware recorders, called Footprint Recording Structures (FRS's), record semantic information about data and control flows of instructions passing through various design blocks of a processor. This information is recorded concurrently during normal operation of a processor in a post-silicon system validation setup. Upon detection of a problem, the recorded information is scanned out and analyzed for bug localization. Special program analysis techniques, together with the binary of the application executed during post-silicon validation, are used for the analysis. IFRA does not require full system-level reproduction of bugs or system-level simulation. Simulation results on a complex super-scalar processor demonstrate that IFRA is effective in accurately localizing bugs with very little impact on overall chip area. | 
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| ISBN: | 1605581151 9781605581156  | 
| ISSN: | 0738-100X | 
| DOI: | 10.1145/1391469.1391569 |