Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA

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Bibliographic Details
Corporate Author International Thermal Conductivity Conference Logan, Utah
Other Authors Ban, Heng (Editor)
Format Electronic eBook
LanguageEnglish
Published Lancaster, PA : DEStech Publications, 2018.
Subjects
Heat > Conduction > Congresses.
Heat > Conduction > Measurement > Methodology > Congresses.
Materials > Thermal properties > Congresses.
Materials > Thermal properties > Measurement > Methodology > Congresses.
Expansion (Heat) > Congresses.
Expansion (Heat) > Measurement > Methodology > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781523153800
1523153806
9781605955353
1605955353
Physical Description1 online resource (xi, 265 pages)

Cover

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040 |a HUA  |b eng  |e rda  |e pn  |c HUA  |d OCLCO  |d OCLCL  |d OCLCF 
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020 |a 1523153806  |q (electronic bk.) 
020 |z 9781605955353  |q hardcover 
020 |z 1605955353  |q hardcover 
035 |a (OCoLC)1392132958 
111 2 |a International Thermal Conductivity Conference  |n (33rd :  |d 2017 :  |c Logan, Utah) 
245 1 0 |a Thermal conductivity 33 :  |b thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA /  |c Heng Ban [editor]. 
264 1 |a Lancaster, PA :  |b DEStech Publications,  |c 2018. 
300 |a 1 online resource (xi, 265 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and author index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Heat  |x Conduction  |v Congresses. 
650 0 |a Heat  |x Conduction  |x Measurement  |x Methodology  |v Congresses. 
650 0 |a Materials  |x Thermal properties  |v Congresses. 
650 0 |a Materials  |x Thermal properties  |x Measurement  |x Methodology  |v Congresses. 
650 0 |a Expansion (Heat)  |v Congresses. 
650 0 |a Expansion (Heat)  |x Measurement  |x Methodology  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Ban, Heng,  |e editor. 
776 0 8 |i Print version:  |a International Thermal Conductivity Conference (33rd : 2017 : Logan, Utah).  |t Thermal conductivity 33.  |d Lancaster, PA : DEStech Publications, [2018]  |z 9781605955353  |w (OCoLC)1155062268 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpTCTE0004/thermal-conductivity-33?kpromoter=marc  |y Full text 

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